Memory compiler redundancy

ABSTRACT

An improved redundancy architecture for embedded memories in an ASIC chip includes one or more compiler-generated embedded memory instances. Each embedded memory instance has a universal register for storing an address of a defective subunit of the memory instance from a variety of sources. A control block is located on the ASIC chip outside of the memory instances. The control block has a defective memory register for storing an address of a defective memory subunit. The address of a defective memory subunit from the defective memory register in the control block is transferred to the universal interface register in the memory instance. In one embodiment, the control block includes fuses for storing a defective subunit address in binary form. A fuse array is located outside of the memory instances and contains laser fuses that represent address of defective subunits for each memory instance. Alternatively, the control block includes a BISTDR (built-in, self-test, diagnostic, and repair) system that provides an address of a defective memory subunit. Means are provided in the memory instances for comparing incoming memory addresses to address bits for defective memory subunits stored in each memory-instance register.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to an application specific integrated circuit(ASIC) and, more particularly, to an ASIC having a redundancy capabilityfor replacement of defective embedded memory subunits of a memoryinstance in the ASIC.

2. Prior Art

In the design and production of an ASIC, a compiler, or higher levelcomputer program, is used by an ASIC designer to convert the designer'skeystroke inputs from a workstation to tape-out information that is usedfor generating production masks that are used to fabricate an ASIC chip.An ASIC design can have a number of different functional units providedon a single chip. These functional units include one or more embeddedmemory instances, or blocks, such as, for example, embedded randomaccess memory (RAM) blocks, that are physically co-located in closeproximity to various other types functional blocks on the ASIC.

Sometimes, an embedded memory instance has a defective memory subunit,such as a defective row or a defective input-output (I/O) unit. An I/Ounit is a group of several memory columns and a multiplexer that is usedto select a particular one of the memory columns for I/O operation.After an ASIC is fabricated and tested, various defective bits (if any)in the memory instances in a particular subunit need to be corrected orreplaced by redundant memory circuits. One redundancy technique uses afuse array that is is provided by the compiler to store an address of adefective subunit of an embedded memory instance.

Prior art memory redundancy techniques are focused on stand-alonememories. A stand alone memory chip uses a very limited number offunctional units in its design while an ASIC uses a considerably largernumber of different functional units in its design. In an ASIC,co-locating a fuse array in the vicinity of a memory instancecomplicates the design and operation of the ASIC. For example, fusearrays take up large amounts of chip area and the structure andfabrication of such a fuse array may not be compatible with thestructure and fabrication of an ASIC embedded memory instance or otherfunctional blocks located near a embedded memory instance in an ASIC.Consequently, there is a need to provide an improved redundancyarchitecture for embedded memories in an ASIC chip.

SUMMARY OF THE INVENTION

It is therefore an object of the invention to provide an improvedredundancy architecture for embedded memories in an ASIC chip. Inaccordance with this and other objects of the invention ASIC chip isprovided that includes one or more compiler-generated embedded memorywhere each embedded memory instance has a universal register for storingan address of a defective subunit of the memory instance. A controlblock is located on the ASIC chip outside of the memory instances. Thecontrol block has a defective memory register for storing an address ofa defective memory subunit. The address of a defective memory subunitfrom the defective memory register in the control block is transferredto the universal interface register in the memory instance. In oneembodiment of the invention, the control block includes fuses forstoring a defective subunit address in binary form. Alternatively, thecontrol block includes a built-in, self-test, diagnostic, and repair(BISTDR) system that provides an address of a defective memory subunit.

The ASIC has one or more compiler-generated embedded memory instanceswherein each of the memory instances has a memory array and also has auniversal interface register for storing an address of a defectivesubunit of the memory array. A fuse array is located outside of thememory instances and contains laser fuses that represent address ofdefective subunits for each memory instance. The fuse array controlblock has a plurality of registers for storing the address of defectivesubunits for each memory instance. Means are provided in the memoryinstances for comparing incoming memory addresses to address bits fordefective memory subunits stored in each memory-instance register.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and form a part ofthis specification, illustrate embodiments of the invention and,together with the description, serve to explain the principles of theinvention:

FIG. 1 is a block diagram of a portion of an ASIC chip that has threememory instances, each having an associated universal interfaceregister, and that has a control circuit and external registers that arelocated on the ASIC chip away from the memory instances.

FIG. 2 is a circuit diagram of a fuse and a fuse latch circuit thatapplies no static voltage across the fuse.

FIG. 3 is a timing chart for control signals to operate a redundancysystem according to the present invention.

FIG. 4 is a circuit diagram of a universal interface register forstoring the addresses of a redundant rows.

FIG. 5 is a circuit diagram of a flip-flop circuit that is used in theuniversal interface register.

FIG. 6 is circuit diagram of a 3-bit register circuit and exclusive norcircuits that compares incoming address bits to stored address bits fora defective subunit of a memory instance.

FIG. 7 is a circuit diagram for enabling normal and redundant word lineenable circuitry.

FIG. 8 is a schematic diagram for normal and shifted I/O connections toan I/O bit slice.

FIG. 9 is a schematic diagram that illustrates how a defective columnassociated with a defective I/O is switched out of a bit sequence usingmultiplexer circuits.

FIG. 10 is a circuit diagram of a multiplexer circuit

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Reference is now made in detail to preferred embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings. While the invention is described in conjunction with thepreferred embodiments, it will be understood that it is not intended tolimit the invention to these embodiments. On the contrary, the inventionis intended to cover alternatives, modifications and equivalents, whichmay be included within the spirit and scope of the invention as definedby the appended claims.

FIG. 1 is a block diagram of three memory instances 10, 12, 14 that areembedded in various portions of an ASIC chip. The drawing illustratesthat each memory instance has associated in close proximity thereto onthe ASIC chip a respective universal interface register 16, 18, 20 thatprovides an interface between a memory array and redundancy controlcircuitry. A universal interface register is loaded to store memoryaddresses of defective subunits of an associated memory instance. Forpurposes of this description, defective memory subunits are, forexample, a defective row or a defective input-output (I/O) unit, but arenot limited thereto. An I/O unit is a group of several memory columnsand a multiplexer that is used to select a particular one of the memorycolumns for I/O operation. Each of the universal registers is embeddedin the ASIC memory instance in close proximity to a respective memoryarray.

A universal interface register accepts address information for defectivesubunits from a variety of sources external to the memory instances 12,14, 16. The source for providing addresses of defective subunits to auniversal interface register is optional. Each universal interfaceregister can receive addresses of defective subunits of a memoryinstance in the memory instance of an ASIC from a number of differenttypes of sources. These sources include, for example, a fuse array, aBISTDR (built-in, self-test, diagnostic, and repair) system, flashmemory, etc. An ASIC user has a choice of a source for providingaddresses of defective subunits of the memory instances to a universalinterface register. This allows information about defective memorysubunits to be externally inputted or to be inputted from a differentarea of an ASIC. Hence the term universal is used to denote that thisregister can accept the addresses of defective memory subunits from avariety of sources.

Also located on the ASIC chip is a control block 22 that is locatedoutside of and separated from the various memory instances 10, 12, 14and their associated universal registers 16, 18, 20. The control blockincludes a control circuit 24 that is used to provide required controlsignals for the control block 22.

The control block 22 also contains means for providing addresses ofdefective memory subunits in each of a number of memory instances. Thecontrol block includes registers 26, 28, 30 that provide addressinformation for defective subunits of corresponding memory instances.Subunits of the memory instances include, rows, columns, and I/O units.I/O units include a plurality of columns and a multiplexer for selectingone of the columns.

FIG. 1 indicates that one means for providing memory addresses ofdefective memory subunits include a fuse array 25. Other means forproviding defective-memory arrays are Flash memory, and built-in selftest, diagnosis, and repair (BISTDR) circuits.

For a system that uses, for example, fuses in a fuse array 25 toidentify the addresses of defective memory subunits, an overview of thebasic operation of the arrangement of FIG. 1 is as follows: On powerupor system reset, the states of the fuses in the fuse array 25 are loadedinto fuse array registers, such as the registers 26, 28, 30. Then thecontents of these registers 26, 28, 30 are serially clocked throughrespective signal lines 32, 34, 36 into the associated universalinterface registers 16, 18, 20 that are located in the respective memoryinstances 10, 12, 14. A memory instance includes a memory array and auniversal interface register. The defective-memory address contents ofthe universal registers 16, 18, 20 are then compared with all incomingmemory addresses such that, when there is a match therebetween, anappropriate redundant row is activated or an appropriate I/O is removedand replaced with a redundant I/O.

One embodiment of the invention has a fuse array that is located outsideof the memory instances, and that stores defective subunit information.This fuse array contains laser fuses that represent the address bits ofbad rows of I/Os for each memory instance. The following fuse embodimentallows for the replacement of two rows and one I/O for each memoryinstance. This particular embodiment has the capability of replacing badrows/IO for up to 52 memory instances in the larger functional chip.

FIG. 2 is a circuit diagram of a fuse 40 that is provided in a fuselatch circuit 42. An important feature of the fuse latch circuit 42 isthat no static voltage is applied across the fuse 40. One embodiment ofthe fuse 40 is constructed with an aluminum layer that is used for bondpads on a chip. An extra layout mask is used to define a window over thefuse that allows for a thin layer of passivation oxide to cover the fuseand this thin layer can be easily cut into by a laser to cut the fuse.There is the possibility that a fuse could self-repair if a sliver offuse material remained after the fuse was cut and if there was a staticvoltage potential across the fuse that could allow current through thesliver.

To prevent this type of self-repair, the fuse latch circuit 42 providesthat there is no static voltage potential across the fuse 40. The fuselatch circuit 42 includes an input terminal 44 for a control signal PULLthat is connected to a gate terminal of a PMOS transistor 46 and also toa gate terminal of an NMOS transistor 48. A source terminal of the NMOStransistor 48 is connected through the fuse 40 to a ground potential. Asource terminal of the PMOS transistor 46 is connected to a positivevoltage source. The drain terminals of the PMOS transistor 46 and theNMOS transistor 48 are connected together to a node A. The inverters 50,52 form a latch with node A being connected to an input terminal of theinverter 50 and to an output terminal of the inverter 52. An outputterminal of the inverter 50 is connected to an input terminal of theinverter 52 and also to a node B. Node B is connected to an inputterminal of a CMOS transmission gate 54. An input terminal 56 for acontrol signal PUL2 is connected to a control terminal of thetransmission gate 54. Terminal 56 is also connected to an input terminalof an inverter 58 which has an output terminal that is connected to acomplementary control terminal of the CMOS transmission gate 54. Anoutput terminal of the CMOS transmission gate 54 is connected to a nodeC. Inverters 60 and 62 form a latch with node C being connected to aninput terminal of inverter 60 and to an output terminal of the inverter62. An output terminal of the inverter 60 is connected to a node D. NodeD is connected through an inverter 64 to an OUT terminal 66.

FIG. 2 illustrates the PULL signal as a single positive pulse signalthat is generated after powerup or system reset. Signal PUL2 is alsoillustrated as a somewhat later and shorter, single positive pulsesignal that is generated after powerup or system reset. The PUL1 signalgoes HIGH to evaluate the state of the fuse 40. The PUL2 signal goeshigh to latch the state of the fuse. If the fuse 40 is blown, node Agoes low, node B goes high, and a high signal is gated into the latch60, 62 when the signal PUL2 goes high. The latch 60, 52 holds its statewhen PUL2 goes low. If the fuse 40 is not blown, the opposite state islatched in the latch 60, 62. When PUL1 goes low, the NMOS transistor 48is cut off so that no static current can be applied through a blown fusesliver of fuse 40.

FIG. 3 illustrates a timing chart for control signals that are providedby the control circuit 24 for internal timing of redundant controlcircuitry. Control logic detects the negative edge of a chip resetsignal and then energizes a T flop counter that counts up to 39, whichresets the control logic until the next reset signal. The variouscontrol signals are created generically by the use of D flip-flops thatare set and reset by detecting various counts from a counter.

Signal CK is the system clock. Signal LSF COUNTER shows the leastsignificant output of the counter with the associated count. PUL1 andPUL2 are as explained above. Signal RESETNK resets the fuse arrayregister. SEK loads the output of the fuses into the fuse arrayregister. FUSECKK provides 27-gated clock pulses that serially load thefuse array register into a bit register of the memory instance. DVALIDgates FUSECKK into the memory instance register.

For one embodiment of the invention, the fuse array register has 27 bitsand is made up of ordinary D flops. This allows for two row addresses of9 bits each, plus one row redundant enable bit (1 bit) and 7 addressbits of one defective I/O plus one I/O redundant enable bit. There are512 rows so the row bits are 9 bits apiece for the row address plus therow redundant enable bit for a total 19 bits allocated for rowredundancy. There are a possible 128 I/Os in the compiler, so thisaccounts for the (remaining 8 bits. Seven bits for the I/O number andone bit for the 10 redundant enable bit for a grand total of 27 bits.

Another embodiment of the invention uses a compiler that designsredundancy capability into an ASIC and memory instances and alsoprovides the addresses of defective memory arrays, but with a BISTDRlogic engine also outside of the memory instances. This BISTR logicengine self tests and replaces bad bits on powerup and system resets,with logic rather than with fuses. Customers using such an ASIC areunaware of the mode of obtaining defective memory addresses.

The next step after powerup or system reset and after loading the fusearray information from the fuses into the fuse array register or afterloading the BISTDR information, is to serially load the information fromthe fuse array register to the memory instance 27 bit redundantregister. Once this is done, the fuse array control logic or other logichas finished its job and reaches a steady state condition, with no moresignal toggling, and waits for the next system reset. After this, logiccircuit in the memory instances take control.

FIGS. 4, 5, and 6 show the details of a 19-bit register circuit 100 in amemory instance. The 19-bit register circuit 100 stores the addresses ofdefective rows that are to be replaced by redundant rows. The 19-bitregister circuit 100 also monitors the memory address input signals todetect the occurrence of an address for a defective row. The 19-bitregister circuit 100 stores addresses of two redundant rows that replacetwo defective rows in the memory instance. The 19-bit register circuit100 handles 19 bits, including 18 row address bits for two 9-bitaddresses and one row redundancy enable bit.

A single signal line 102 receives the 27-bit serial bit stream RA[26:0]from the FUSE ARRAY REGISTER. A serial data input terminal SD of a 1-bitregister circuit 104 is connected to the signal line 102 to receive the27-bit serial bit stream from the FUSE ARRAY REGISTER. A REDUNDANTENABLE BIT is provided at a Q output terminal of the 1-bit registercircuit 102, which is connected by a signal line 105 to a serial inputterminal SD of a first 3-bit register 106 of a serially-loaded 18-bitregister that is formed with six series-connected 3-bit registercircuits 106, 107, 108, 109, 110, 111. The six 3-bit register circuits106, 107, 108, 109, 110, 111 are connected in series such that a Qoutput terminal of the first 3-bit register 106 is connected to a SDinput terminal of its neighboring 3-bit register 107, and so on for therest of the 3-bit registers. The Q output terminal is connected to aterminal 112 to provide a redundant SCAN OUTPUT signal RUDSCANOUT to aninput terminal of an 8-bit I/O register that stores an address of aredundant I/O address.

A clock signal CK is applied to one input terminal 114 of a 2-input ANDgate that is formed with a 2-input NAND gate 116 in series with aninverter 118. The DVALID signal is applied to the other input terminal120 of the 2-input AND gate. When the DVALID signal is HIGH, the CKsignal is gated through the AND gate to provide a redundant clock signalRUDCLK that is applied to the clock terminals of the 1-bit registercircuit 104. The redundant clock signal RUDCLK is also applied to theclock terminals of the six 3-bit resister circuits 106, 107, 108, 109,110, 111.

A reset pulse is provided to an input terminal 122 of an inverter 124that provides an inverted output signal RESETN that is applied torespective reset terminals of the 1-bit register and the six 3-bitregister circuits 106, 107, 108, 109, 110, 111.

The DVALID signal is also connected to an enable input terminal 126 ofthe 1-bit register circuit 102 to allow 27 bits of the serial data fromthe single signal line 102 to be serially clocked through the 1-bitregister circuit 102 and through the six 3-bit register circuits and the8-bit I/O register.

After the fuse array information is loaded from the fuses into the fusearray register, the 27 bits of information from the fuse array registerare serially transferred and loaded into the memory instance 27-bitredundant register. The memory instance 27-bit redundant registerincludes the 19-bit register circuit 100 and the 8-bit I/O register (NOTSHOWN).

Each of the 3-bit registers also contain EXCLUSIVE-OR circuits thatcompare the contents of a respective 3-bit register to respective bitsof the address signals provided on a 19-line memory address bus 130 fornineteen address bits ADB[18:0]. Each of the three 3-bit registers 106,107, 108 contain three bits of one 9-bit defective row address.Similarly, each of the three 3-bit registers 109, 110, 111 contain threebits of another 9-bit defective row address.

Each of the 3-bit registers contains an EXCLUSIVE-OR circuit thatprovide signals at all three respective output nodes N13, N12, N11 whena match is obtained for one defective row address and that providessignals at all three respective output nodes N23, N22, N21 for the otherdefective row address. The nodes N13, N12, N1 are connected torespective input terminals of a 3-input NAND gate 130. Similarly, thenodes N23, N22, N21 are connected to respective input terminals of a3-input NAND gate 132.

An output terminal of the 3-input NAND gate 130 is connected to an inputterminal of an inverter 134 such that the 3-input NAND gate 1130 and theinverter 134 form a 3-input AND gate. An output terminal of the inverter134 is connected to one input terminal of a NAND gate formed with a2-input NAND gate in series with an inverter 138. The REDUNDANT ENABLEBIT provided at the Q output terminal of the 1-bit register circuit 104is connected to the other input terminal of the 2-input NAND gate 136.When the REDUNDANT ENABLE BIT is HIGH and all three nodes N13, N12, N11are HIGH, a redundant address RUDADR signal is provided at an outputterminal 140 of the inverter 138 goes HIGH to indicate that the addressof the one defective row has been received on the bus 130.

An output terminal of the 3-input NAND gate 132 is connected to oneinput terminal of a 2-input NAND gate 142. The other input terminal ofthe 2-input NAND gate 142 is connected to the output terminal of the3-input NAND gate 130. An output terminal of the 2-input NAND gate 142is connected to one input terminal of a 2-input NAND gate 144. The otherinput terminal of the 2-input NAND gate 144 is connected to theREDUNDANT ENABLE BIT provided at the Q output terminal of the 1-bitregister circuit 104. The 2-input NAND gate 144 is connected in serieswith an inverter 146 to provide an AND function. An output terminal ofthe inverter 146 provides a redundancy enable signal RUDE.

The nodes N13, N12, and N11 indicate matching of one failure address andnodes N23, N22, and N21 indicate matching of the second failure address.

The redundancy enable RUDE signal at the output terminal of the inverter146 goes to a HIGH when there is a match for either one of the failureaddresses with an incoming address. The signal RUDADR at terminal 140indicates which of the two possible failure addresses has been a matchwith an incoming address.

An advantage of the present invention is that delay is not introducedinto the system because the delay through the comparators is hiddenwithin the normal setup and hold time of the address decoder. If bothrow and I/O redundancy is used, there is a speed penalty.

FIG. 5 illustrates a flip-flop circuit 200 that is a standard cell thatis used for the 1-bit register circuit 104 and also for each registercell of the 3-bit registers 106, 107, 108, 109, 110. A first CMOStransmission gate 202 connects a D-input node 204 to an input node 206.A second CMOS transmission gate 208 connects a SD-input node 210 to theinput node 206. A DVALID input signal is provided at a DVALID inputterminal and is inverted by an inverter 214. The DVALID and invertedDVALID input signals control the CMOS transmission gates 202, 208 sothat a SD input signal is provided at input node 206 when the DVALIDsignal is HIGH. Otherwise, a grounded D input signal is connected to theinput node 206.

A resettable latch 212 has an input terminal that is connected to theinput node 206 and an output terminal that is connected through aninverter 2114 to a node 216. Another CMOS transmission gate connectsnode 216 to an input node 220 of a latch formed with an inverter 222 anda CMOS transmission gate 224. A Q output signal is provided through aninverter 226 to a Q output terminal from the node 220. An input clocksignal CK is provided at an input terminal 230 and passed through afirst inverter 232 and then through a second inverter 234 to providevarious control signals. An inverted reset signal RESETN is provided toan input terminal 236 to provide various reset signals.

FIG. 6 illustrates a 3-bit register circuit 300 such as shown in FIG. 4as one of the 3-bit registers 106, 107, 108, 109, 110, 111. The 3-bitregister circuit 300 includes three series-connected scanable flip-flopcircuits 302, 304, 306 that are like the scanable flip-flop circuit 200of FIG. 5. The 3-bit register circuit 300 has a data input terminal 308that is connected to the SD input terminal of the first scanableflip-flop circuits 302. A clock input CK terminal 310 is connected tothe clock input CK terminals of each of the three scanable flip-flopcircuits 302, 304, 306. An inverted reset signal RESETN is connected toan inverted reset input terminal 312 of each of the three scanableflip-flop circuits 302, 304, 306. A DVALID input terminal 314 isconnected to each of the three scanable flip-flop circuits 302, 304,306. The CK signal serially clocks data through the three flip-flopcircuits 302, 304, 306, such that each flip-flop circuit has a Q outputterminal and an inverted Q terminal QN. The Q output terminal of thescanable flip-flop circuit 306 is connected to a SCANOUT terminal whichis connected to a next 3-bit register.

FIG. 6 also shows three 3-input EXCLUSIVE-OR circuits 320, 322, 324 forcomparing three incoming address bits provided on the 3-bit address busADR[2:0] 326 to the Q and QN bits stored in a respective one of thescanable flip-flop circuits 302, 304, 306. The 3-bits are predeterminedbits that are part of the 19-line memory address bus 130.

The 3-input EXCLUSIVE-OR circuit 320 has one input terminal connected toone of the address lines of the bus 320. A second input terminal isconnected to the Q terminal of the scanable flip-flop circuit 302. Athird inverted input terminal is connected to the QN terminal of thescanable flip-flop circuit 302.

The 3-input EXCLUSIVE-OR circuit 322 has one input terminal connected toa second one of the address lines of the bus 320. A second inputterminal is connected to the Q terminal of the scanable flip-flopcircuit 304. A third inverted input terminal is connected to the QNterminal of the scanable flip-flop circuit 304.

The 3-input EXCLUSIVE-OR circuit 324 has one input terminal connected toa third one of the address lines of the bus 320. A second input terminalis connected to the Q terminal of the scanable flip-flop circuit 306. Athird inverted input terminal is connected to the QN terminal of thescanable flip-flop circuit 306.

Output terminals of the three EXCLUSIVE-OR circuits 320, 322, 324 areconnected to respective ones of the input terminals of a 3-input NANDgate 326. An output terminal of the 3-input NAND gate 326 is connectedto an input terminal of an inverter 328 that provides an OUT signal atan output terminal 330. Output terminal 330 is the same as terminalsN13, N12, N11, N23, N22, or N21 of FIG. 4. The EXCLUSIVE-OR circuitscompare the defective-row-address bits in the registers 302, 304, 306with respective incoming address bits, and when there is a match, signalOUT goes to a HIGH.

FIG. 7 is a simplified schematic diagram for word-line enable circuitry400 that is used to enable both normal rows and redundant rows. Acontrol circuit 402 has an address input terminal 404 that receives asingle address bit ADDR, a redundant input terminal 406 that receives aredundant enable RUDE signal, and a clock input terminal 408 thatreceives the clock CK signal. As discussed in connection with FIG. 4,the redundancy enable RUDE signal goes to a HIGH when there is a matchfor either one of the failure addresses with an incoming address.

For normal operation, the redundant enable RUDE signal is inactive andthe clock signal causes the control circuit 402 to provide either anegative PULSEO pulse output signal or a negative PULSE1 pulse outputsignal, depending on the value of the single address bit ADDR. Thenegative pulse signal for the PULSE0 signal is then provided to an inputterminal 410 of a CMOS transmission gate 412. An output terminal of theCMOS transmission gate 412 is connected through an inverter 414 to anoutput terminal 416 at which is provided a normal wordline enable signalWL0. Similarly, the negative pulse signal for the PULSE1 signal isprovided to an input terminal 418 of another CMOS transmission gate 420.An output terminal of the CMOS transmission gate 420 is connectedthrough an inverter 422 to an output terminal 424 at which is provided anormal wordline enable signal WL1.

A predecoder circuit 426 detects certain row addresses and providesinput signals to a row decoder that is a multi-input NAND gate 428. TheNAND gate 428 provides a row decoder control signal to a node 430 thatis connected to PMOS gate terminals of the CMOS transmission gates 412,420. Node 430 is connected through an inverter 432 to NMOS gateterminals of the CMOS transmission gates 412, 420. The row decodercontrol signal enables the CMOS transmission gates 412, 420 to providethe normal wordline enable signals WL0 and WL1 for normal operation.

For redundant operation, when the redundant enable input signal RUDE atterminal 406 goes active, the redundant pulse signal PULSER signal goesactive negative when a clock pulse CK is received. In this case, thecontrol circuit 402 prevents both the PULSE0 signal and the PULSE1signal from going active.

When the redundant enable input signal RUDE at terminal 406 of thecontrol circuit 402 goes active, the redundant PULSER signal is providedto a node 434 that is connected to an input terminal of a CMOStransmission gate 436 and to an input terminal of another CMOStransmission gate 438. A D flip-flop circuit 440 has a D input terminalat Which is provided the redundant address RUDADR signal from the 19-bitregister circuit 100 of FIG. 4. A clock signal CK at a clock inputterminal 444 provide an ADDRU signal to an output terminal 446 of the Dflip-flop circuit 440.

As indicated in the discussion in connection with FIG. 4, the signalRUDADR at terminal 140 indicates which of the two possible failureaddresses has been a match with an incoming address.

The ADDRU signal at node 446 is connected to PMOS gate terminals of thetransmission gates 436, 438. Node 446 is connected through an inverter448 to NMOS gate terminals of the CMOS transmission gates 436, 438. Node446 is directly connected to PMOS gate terminals of the CMOStransmission gates 436, 438.

An output terminal of the CMOS transmission gate 436 is connectedthrough an inverter 440 to an output terminal 442 at which is provided aredundant wordline enable signal WRWL0. An output terminal of the CMOStransmission gate 438 is connected through an inverter 444 to an outputterminal 446 at which is provided a redundant wordline enable signalRWL1.

FIGS. 8 and 9 show a schematic diagram for a memory system 500 thatprovides a redundant column input/output (I/O) bit slice 502 when thereis a defective I/O bit slice in a regular column I/O bit slice.Illustratively shown are some regular column I/O bit slices 504, 505,506, 507, which are some of a larger number of regular column bit slicesfor a memory device. Internally, each of the regular column I/O bitslices contains two or more memory columns, an internal y-multiplexerfor selecting one of those memory columns, and a sense amplifier.

Each of the regular column bit I/O bit slices 504, 505, 506, 507 has arespective I/O terminal 508, 509, 510, 511 that is connected to firstrespective I/O terminal 512, 513, 514, 515 of a respective multiplexer516, 517, 518, 519. The regular column I/O bit slices 505, 506, 507 andthe redundant bit slice 502 each also have a second respective I/Oterminal 520, 521, 522, 523 that is cross-connected to another I/Oterminal 524, 525, 526, 527 of a respective neighboring multiplexer 516,517, 518, 519.

Normal operation occurs when there are no defective I/O bit slices. Fornormal operation, the first respective I/O terminals 512, 513, 514, 515are connected through the respective multiplexers 516, 517, 516, 519 torespective third I/O terminals 528, 529, 530, 531.

Redundant operation occurs when one of the I/O bit slices is defective.For redundant operation, FIG. 9 illustrates how the multiplexers 516,517, 518, 519 are used to isolate and bypass a defective column, suchas, for example, the I/O bit slice 505. The multiplexers provide a shiftmechanism that has the redundant bit slice 502 and its associatedcolumns placed on one side of the array. The columns associated with thedetective I/O bit slice are isolated and not used. Instead the columndata associated with the defective I/O slice are shifted by themultiplexers 517, 518, 519 to adjacent I/O bit slices. The shiftcontinues all the way to the redundant bit slice 502. The redundant bitslice 502 contains the same amount of columns as a I/O bit slice.

FIG. 10 is a circuit diagram of a typical multiplexer circuit 600, suchas one of the multiplexers 516, 517, 518, 519 of FIGS. 8 and 9. A4-input NAND gate 602 has one input terminal 603 for receiving a RBEsignal that is the buffered redundant I/O enable bit from the 1-bitregister circuit 104 of the memory instance redundant register, providedby the 19-bit register circuit 100. Three other r input terminals 604,605, 606 to the 4-input NAND gate receives address signals A1, A2, andA3 which are predecoded signals derived from the 7 redundant I/O bitaddress also contained in the memory instance redundant register.

An output terminal of the 4-input NAND gate 602 is connected to oneinput terminal of a 2-input NAND gate 608. An SCI input terminal 610 ofthe 2-input NAND gate receives a shift-carry input signal SCI from aneighboring I/O bit slice. An output terminal of the 2-input NAND gatein connected to an input terminal of an inverter 610. A output terminalof the inverter 610 is connected to an SCO output terminal 612 at whichis provided a shift-carry output signal SC0. The SCO output terminal 612of one I/O bit slice is connected to an SCI input terminal of the nextI/O bit slice to form a chain across all of the I/O bit slices.

The SCI signal, when active low, indicates that a shift to the next I/Obit slice is required. Another way to require a shift is for the outputof the 4-input NAND gate 602 to go low, which occurs when the associatedI/O bit slice is defective. Both of these shift requirements result inthe SCO signal going active low.

A data-in DI terminal 620 is connected to input terminals of two CMOStransmission gates 522, 624. The SCO output terminal 612 is connectedthe PMOS control gate of the CMOS transmission gate 624 and to the NMOScontrol gate of the CMOS transmission gate 622. The SCO output terminal612 is also connected to an inverter that has an SCON output terminal628 at which is provided an inverted shift-carry output signal SCON. TheSCON output terminal 628 is connected to the NMOS control gate of theCMOS transmission gate 624 and the PMOS control gate of the CMOStransmission gate 622.

A normal data-out signal DOUTO is applied to a terminal 630 that isconnected to an input terminal of a CMOS transmission gate 632. Ashifted data-out signal is applied to a terminal 634 that is connectedto an input terminal of a CMOS transmission gate 636. Both outputterminals of the CMOS transmission gates 632, 636 are connected to aninput terminal of a data-out buffer circuit 638. The data-out buffercircuit 638 has a tri-state output terminal at which is provided a DOUTsignal when an output enable signal OE is provided at an enable terminal642 thereof. The SCON output terminal 62B is connected to a PMOS controlterminal of the transmission gate 636 and the NMOS control gate of thetransmission gate 632. Terminal 628 is also connected to an inputterminal of an inverter 642 that has an output terminal connected to thePMOS control gate of the CMOS transmission gate 632 and to the NMOScontrol gate of the CMOS transmission gate 636.

An active LOW state of the SCO signal causes the DI signal to be shiftedover to the next I/O bit slice. The active LOW state of the SCO signalalso cause the DOUT signal to receive its input from the shifted DOUTSsignal as outputted from the next I/O bit slice. When the SCO signal isinactive HIGH, the Dl and DOUT signal are normally connected to normallyconfigured I/O bit slices.

The foregoing descriptions of specific embodiments of the presentinvention have been presented for purposes of illustration anddescription. They are not intended to be exhaustive or to limit theinvention to the precise forms disclosed, and obviously manymodifications and variations are possible in light of the aboveteaching. The embodiments were chosen and described in order to bestexplain the principles of the invention and its practical application,to thereby enable others skilled in the art to best utilize theinvention and various embodiments with various modifications as aresuited to the particular use contemplated. It is intended that the scopeof the invention be defined by the Claims appended hereto and theirequivalents.

1. An application specific integrated circuit (ASIC) chip, comprising:one or more compiler-generated embedded memory instances of an ASICcompiler, at least one of said embedded memory instances including auniversal register for storing an address of a defective subunit of thememory instance; a control block located on said ASIC chip outside ofthe memory instances, said control block including a defective memoryregister for storing an address of a defective memory subunit; means fortransferring the address of a defective memory subunit from thedefective memory register in the control block to the universalinterface register in the memory instance; and means for comparing anincoming memory address to said address stored in said universalregister.
 2. The ASIC chip of claim 1 wherein the control block includesfuses for storing a subunit address in binary form.
 3. The ASIC chip ofclaim 1 wherein the control block includes a BISTDR (built-in,self-test, diagnostic, and repair) system to provide an address of adefective memory subunit.
 4. The ASIC chip of claim 1 wherein thecontrol block includes a volatile fuse array to provide an address of adefective subunit.
 5. An integrated circuit created by a memorycompiler, comprising: an ASIC having one or more compiler-generatedembedded memory instances of an ASIC compiler, at least one of saidmemory instances including a memory array and including a universalinterface register for storing an address of a defective subunit of saidmemory array; a fuse array external to the memory instances and thatcontains laser fuses to represent addresses of defective subunits forsaid at least one of said memory instances; said fuse array controlblock including a plurality of registers for storing the address ofdefective subunits for said at least one of said memory instances; meansfor transferring the address of one or more defective subunits for saidat least one of said memory instances to an associated memory instance;means for comparing incoming memory addresses to address bits fordefective memory subunits stored in said register of said at least oneof said memory instances; and means, responsive to matching addressesdetected in said comparing means, for activating a redundant subunit inplace of the defective subunit.
 6. An application specific integratedcircuit (ASIC), comprising: a plurality of embedded memory instancesincluding memory arrays, wherein at least one of said memory has arraysincludes one or more memory subunits, at least one of said memorysubunits including rows and I/O units; said at least one of saidembedded memory instances including a universal interface register forreceiving and storing an address of a defective memory subunit; means,external to the memory array, for providing the address of the defectivememory subunit to the universal interface register; and means forcomparing an incoming memory address to said address stored in saiduniversal interface register.
 7. The ASIC of claim 6 wherein the memorysubunits include rows and I/O units having a plurality of columns and amultiplexer for selecting one of said plurality of columns.
 8. The ASICof claim 6 wherein the means for providing the address of the defectivememory subunit includes a fuse array to encode the address of thedefective memory subunit.
 9. The ASIC of claim 6 wherein the means forproviding the address of the defective memory subunit includes a memoryto store the states of various fuses of the fuse array.
 10. The ASIC ofclaim 6 wherein the means for providing the address of the defectivememory subunit includes a built-in self test and diagnostic and repairBISTDR function.
 11. The ASIC of claim 6 wherein the means for providingthe address of the defective memory subunit includes flash memory.12-16. (canceled)
 17. An apparatus comprising: an integrated circuitchip (IC) including a memory array and compiler-generated embeddedmemory instances of a IC compiler, a memory instance including auniversal interface register for storing at least one memory addressassociated with a defective subunit of said memory array; a fuse arrayexternal to the memory instances, said fuse array including laser fusesto represent memory addresses of defective subunits and furtherincluding a fuse array control block including registers for storingmemory addresses of a defective subunits; means for transferring thememory address stored in said fuse array control block into theuniversal interface register associated with the defective subunit ofsaid memory array represented by the memory address being transferred;and means for activating a redundant subunit in place of the defectivesubunit in response to a comparison of incoming memory addresses toaddresses for the defective memory subunits stored in universalinterface registers.
 18. The apparatus of claim 17, wherein the meansfor activating is capable of activating an appropriate redundant row inthe embedded memory instance in place of a defective row.
 19. Theapparatus of claim 17, wherein the means for activating is capable ofisolating and bypassing a defective I/O unit by utilizing an appropriateredundant I/O unit in the embedded memory.
 20. The ASIC chip of claim 1,further including means, responsive to matching addresses detected insaid comparing means, for activating a redundant subunit in place of thedefective subunit.
 21. The ASIC chip of claim 20, wherein the means foractivating is capable of activating an appropriate redundant row in theembedded memory instance in place of a defective row.
 22. The ASIC chipof claim 20, wherein the means for activating is capable of isolatingand bypassing a defective I/O unit by utilizing an appropriate redundantI/O unit in the embedded memory.
 23. The ASIC chip of claim 5, whereinthe means for activating is capable of activating an appropriateredundant row in the embedded memory instance in place of a defectiverow.
 24. The ASIC chip of claim 5, wherein the means for activating iscapable of isolating and bypassing a defective I/O unit by utilizing anappropriate redundant I/O unit in the embedded memory.
 25. The ASIC chipof claim 7, further including means, responsive to matching addressesdetected in said comparing means, for activating a redundant subunit inplace of the defective subunit.
 26. The ASIC chip of claim 25, whereinthe means for activating is capable of activating an appropriateredundant row in the embedded memory instance in place of a defectiverow.
 27. The ASIC chip of claim 25, wherein the means for activating iscapable of isolating and bypassing a defective I/O unit by utilizing anappropriate redundant I/O unit in the embedded memory.